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ST1331	文件：277.48 Kbytes Page：13 Pages	Memory Micromodules General Information for D1, D2 and C Packaging DESCRIPTION MemoryCardsconsistoftwomainparts:theplasticcard,andtheembeddedMicromodule(which,inturn,carriesthesiliconchip). ■Micromodulesweredevelopedspecificallyfor embeddinginSmartcardsandMemoryCards ■TheMicromoduleprovides: –Supportforthechi	STMICROELECTRONICSSTMicroelectronics 意法半导体意法半导体（ST）集团	STMICROELECTRONICS
ST1331	文件：30.2 Kbytes Page：3 Pages	6-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms DESCRIPTION ThemembersoftheST1331/1333/1353familyareprincipallydesignedforuseinprepaidPhonecardapplications.Eachisa272-bitEEPROMdevice,withassociatedsecuritylogicandspecialfusestocontrolmemoryaccess.Thememoryisarrangedasamatrixof34x8cells,accessedin	STMICROELECTRONICSSTMicroelectronics 意法半导体意法半导体（ST）集团	STMICROELECTRONICS
ST1331-BD10	文件：30.2 Kbytes Page：3 Pages	6-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms DESCRIPTION ThemembersoftheST1331/1333/1353familyareprincipallydesignedforuseinprepaidPhonecardapplications.Eachisa272-bitEEPROMdevice,withassociatedsecuritylogicandspecialfusestocontrolmemoryaccess.Thememoryisarrangedasamatrixof34x8cells,accessedin	STMICROELECTRONICSSTMicroelectronics 意法半导体意法半导体（ST）集团	STMICROELECTRONICS
ST1331-BW2	文件：30.2 Kbytes Page：3 Pages	6-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms DESCRIPTION ThemembersoftheST1331/1333/1353familyareprincipallydesignedforuseinprepaidPhonecardapplications.Eachisa272-bitEEPROMdevice,withassociatedsecuritylogicandspecialfusestocontrolmemoryaccess.Thememoryisarrangedasamatrixof34x8cells,accessedin	STMICROELECTRONICSSTMicroelectronics 意法半导体意法半导体（ST）集团	STMICROELECTRONICS
ST1331-BW4	文件：30.2 Kbytes Page：3 Pages	6-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms DESCRIPTION ThemembersoftheST1331/1333/1353familyareprincipallydesignedforuseinprepaidPhonecardapplications.Eachisa272-bitEEPROMdevice,withassociatedsecuritylogicandspecialfusestocontrolmemoryaccess.Thememoryisarrangedasamatrixof34x8cells,accessedin	STMICROELECTRONICSSTMicroelectronics 意法半导体意法半导体（ST）集团	STMICROELECTRONICS
ST1331-CD10	文件：30.2 Kbytes Page：3 Pages	6-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms DESCRIPTION ThemembersoftheST1331/1333/1353familyareprincipallydesignedforuseinprepaidPhonecardapplications.Eachisa272-bitEEPROMdevice,withassociatedsecuritylogicandspecialfusestocontrolmemoryaccess.Thememoryisarrangedasamatrixof34x8cells,accessedin	STMICROELECTRONICSSTMicroelectronics 意法半导体意法半导体（ST）集团	STMICROELECTRONICS
ST1331-CW2	文件：30.2 Kbytes Page：3 Pages	6-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms DESCRIPTION ThemembersoftheST1331/1333/1353familyareprincipallydesignedforuseinprepaidPhonecardapplications.Eachisa272-bitEEPROMdevice,withassociatedsecuritylogicandspecialfusestocontrolmemoryaccess.Thememoryisarrangedasamatrixof34x8cells,accessedin	STMICROELECTRONICSSTMicroelectronics 意法半导体意法半导体（ST）集团	STMICROELECTRONICS
ST1331-CW4	文件：30.2 Kbytes Page：3 Pages	6-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms DESCRIPTION ThemembersoftheST1331/1333/1353familyareprincipallydesignedforuseinprepaidPhonecardapplications.Eachisa272-bitEEPROMdevice,withassociatedsecuritylogicandspecialfusestocontrolmemoryaccess.Thememoryisarrangedasamatrixof34x8cells,accessedin	STMICROELECTRONICSSTMicroelectronics 意法半导体意法半导体（ST）集团	STMICROELECTRONICS
1331	文件：137.97 Kbytes Page：2 Pages	SMDRFManualTunableInductor	YANTELYantel Corporation 研通高频深圳市研通高频技术有限公司	YANTEL
1331	文件：1.7527 Mbytes Page：13 Pages	PP15/45seriesarethesmallestPowerpole®housings. •HighPowerDensity Upto55ampsinacompactfootprint •Wire-to-Wire&Wire-to-BoardConfigurations Wire&PCBcontactscanbeusedinthesamehousings •FingerProofHousingsAvailable Protectsagainstaccidentalcontactwithlivecircuits	APP Anderson Power Products, Inc.	APP
1331A	文件：257.899 Kbytes Page：3 Pages	Fieldbus,16Pr#18StrTC,POIns,IS/OS,PVCJkt,CMG	BELDEN Belden Inc.	BELDEN
1331-BK	文件：1.7527 Mbytes Page：13 Pages	PP15/45seriesarethesmallestPowerpole®housings. •HighPowerDensity Upto55ampsinacompactfootprint •Wire-to-Wire&Wire-to-BoardConfigurations Wire&PCBcontactscanbeusedinthesamehousings •FingerProofHousingsAvailable Protectsagainstaccidentalcontactwithlivecircuits	APP Anderson Power Products, Inc.	APP
1331R	文件：1.24807 Mbytes Page：1 Pages	ShieldedSurfaceMountInductors	API API Delevan Inc.	API
AM1331F	文件：228.78 Kbytes Page：8 Pages	HIGHCONTACTCAPACITY,PRECISEOPERATION AM1(NZ)SWITCHES FEATURES •10ACurrentswitchingcapacity •Highprecisionandlonglife •Versatilevarietyofactuators •ScrewterminaltypescanbeusedwithM4crimpterminals TYPICALAPPLICATIONS •Transfermachine •Packingmachine •Textileequipment •Cuttingmachine •Foot	PanasonicPanasonic Corporation 松下松下电器	Panasonic
AM1331P	文件：129.15 Kbytes Page：5 Pages	P-Channel30-V(D-S)MOSFET	AnalogPower Analog Power	AnalogPower
AOZ1331ADI	文件：854.44 Kbytes Page：14 Pages	DualChannelSmartLoadSwitch GeneralDescription TheAOZ1331ADIisadualchannelloadswitchwithtypical 20mΩon-resistanceinasmallpackage.Itcontainstwo n-channelMOSFETsforupto5.5Vinputvoltageoperation and6Acurrenteachchannelwith2.5Vto5Vbias supply.Eachloadswitchisindependentlycontrolledb	AOSMDAlpha & Omega Semiconductors 万国半导体美国万国半导体	AOSMD
AOZ1331DI	文件：1.08966 Mbytes Page：14 Pages	DualChannelSmartLoadSwitch	AOSMDAlpha & Omega Semiconductors 万国半导体美国万国半导体	AOSMD
AS1331	文件：3.00039 Mbytes Page：17 Pages	300mABuck-BoostSynchronousDC/DCConverters	AMSCO austriamicrosystems AG	AMSCO
AS1331	文件：2.33268 Mbytes Page：16 Pages	300mABuck-BoostSynchronousDC/DCConverters GeneralDescription Thisspecialdeviceisasynchronousbuck-boostDC/DCconverterwhichcanhandleinputvoltagesabove,below,orequaltotheoutputvoltage. DuetotheinternalstructureoftheAS1331whichisworkingcontinuouslythroughalloperationmodesthisdeviceisidealfordualor	AMSCO austriamicrosystems AG	AMSCO
AS1331-BTDT-AD	文件：2.33268 Mbytes Page：16 Pages	300mABuck-BoostSynchronousDC/DCConverters GeneralDescription Thisspecialdeviceisasynchronousbuck-boostDC/DCconverterwhichcanhandleinputvoltagesabove,below,orequaltotheoutputvoltage. DuetotheinternalstructureoftheAS1331whichisworkingcontinuouslythroughalloperationmodesthisdeviceisidealfordualor	AMSCO austriamicrosystems AG	AMSCO

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型号：
ST1331
制造商：
STMICROELECTRONICS
制造商全称：
STMicroelectronics
功能描述：
Memory Micromodules General Information for D1, D2 and C Packaging

供应商	型号	品牌	批号	封装	库存	备注	价格
深圳市勤思达科技有限公司	ST1331	ST	23+	DIP8	7800	全新原装正品,现货销售	询价
深圳市兴灿科技有限公司	ST1331	STM	23+	DIP8	28500	授权代理直销,原厂原装现货,假一罚十,特价销售	询价
中科航电（深圳）电子集团有限公司	ST1331	ST		DIP8	36900	集团化配单-有更多数量-免费送样-原包装正品现货-正规	询价
深圳市星佑电子有限公司	ST1331	ST	22+	DIP8	16900	支持样品原装现货提供技术支持!	询价
瀚佳科技(深圳)有限公司	ST1332	只做原装	21+	QFN40	36520	一级代理/放心采购	询价
深圳市明盛嘉电子科技有限公司	ST1332	ST/意法	21+	DIP-8	5000	原装现货/假一赔十/支持第三方检验	询价
深圳廊盛科技有限公司	ST1332	SITRONIX	22+	QFN40	50000	只做原装正品,假一罚十,欢迎咨询	询价
深圳市科恒伟业电子有限公司	ST1332-N40	SITRONI	2016+	QFN	6528	只做原装正品现货!或订货	询价
深圳市向鸿伟业电子有限公司	ST1332-N40	SITRONIX	1604+	QFN	2158	低价支持实单,可送样品!	询价
深圳市莱克讯科技有限公司	ST1332-N40	SITRONIX	2017+	QFN	65895	深圳代理原装现货进口库存(香港-日本-台湾)开17点增票	询价

更多ST1331供应商更新时间2024-5-21 12:00:00

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