32-bit Arm® Dual Cortex-M33 TrustZone® microcontroller for Industrial andConsumer IoT Applications with USB HS and FS, CAN FD, LP FlexcommInterface, SDIO, 32-bit counter/timers, SCTimer/PWM, FlexPWM, 4x 16-bit2.0 Msamples/sec ADC, Comparator, Temperature Sensor, PKC, AES,PUF, SHA, CRC, RNG

•Highly secure: TrustZone for Armv8-M, secure boot/update ROM, NXP'sEdgeLock® secure subsystem (ELS) S50 black-box secure enclavewith key storage and crypto algorithms protected from side-channelattacks as well as internal/external tamper events, flash encryption,external memory interface with on-the-fly PRINCE decryption, optionsfor hardware Physically Unclonable Function (PUF) and Factory Root ofTrust programming

•Industrial Strength: Industrial communication protocol support, 15-yearlongevity, high-resolution mixed signal analog, CAN-FD, BLDC/PMSMMotor Control support, integrated sensor interfaces (MIPI-I3C, I2C, SPI)

•Power-efficient: < 70 μA/MHz active current, < 10 μA Power down modewith RTC enabled and 8 KB SRAM retention, < 2.5 μA Deep Power-down mode with RTC active and 8 KB SRAM

Target Applications

•Industrial and Consumer IoT

•Industrial Communications

•Smart Metering

•Motor Control

•Automation & Control

•Sensors

CPU Core Platform

•Primary CPU: Cortex-M33

—TrustZone, MPU, FPU, SIMD, ETM, CTI

•Secondary CPU: Cortex-M33 Barebone

•DSP Accelerator (PowerQUAD, w CP intf)

•SmartDMA

•N1-16 Neural Processing Unit (NPU)

•Coolflux BSP32

•Secure Multilayer Bus Matrix

Advanced Security

•ELS S50

—AES-256, SHA-2, RNG

—ECC-256 (ECDSA, ECDH)

•PKC (Asymmetric Crypto accelerator)

•SRAM PUF for RoT Key

•PRINCE OTF Encrypt/Decrypt for internal and externalFlash

•Protected Flash Region (PFR)

•DICE and UID and Debug authentication

•2x Code Watchdog

•Tamper Detect

—Eight tamper pins

—Active and passive tamper pin detect

—Voltage tamper detect

•Two asynchronous DMA modules (16-channels each)

Memories and memory expansion

•Dual-bank Flash supporting Flash Swap and Read WhileWrite: Up to 2x 1024 KB FLASH instances with ECC(support one bit correction and two bits detection).

•Cache Engine with 16 KB RAM

•Up to 512KB RAM (up to 416KB with configurable ECCthat supports single correction, double bit detection)

•Up to 4x 8 KB ECC RAM can be retained down to VBATmode

•FlexSPI with 16 KB cache supporting XIP, Octal/QuadSPI flash, HyperFlash, HyperRAM, Xccela memory types

•256 KB ROM

Low-Power Performance

•Active

—75 μA/MHz (3.3 V, @25 C) in OD Active Mode(While(1) executing from flash, DC/DC enabled)

•Deep Sleep

—270 μA, (full 512 KB SRAM retention, 3.3 V @25 C)

•Power Down

—4.2 μA, (full 512 KB SRAM retention, 3.3 V, @25 C)

•Deep Power Down

—< 2.0 μA, 5.3 ms wake-up (RTC enabled 8 KB RAMand Reset pin enabled, @25 C)

Flexible System and Clocks

•144 MHz free-running oscillator (FRO-144M)

•12 MHz free-running oscillator (FRO-12M)

•16 kHz free-running oscillator (FRO-16k)

•32 kHz low-power crystal oscillator

•Up to 50 MHz low-power crystal oscillator

•2 x phase-locked loop

•Hardware and Software Watchdogs

Communication interfaces

•USB High-speed (Host/Device) with on-chip HS PHY

•USB Full-speed (Host/Device) with on-chip FS PHY,USB Device

•uSDHC

—Temperature tamper detect

—Clock tamper detect

•OTP Fuses

—Can permanently configure boot and securityoptions

—4 KB fuse area

—Up to 384 b fuse area for storing key hashes

—Key revocation capability

•Digital Glitch Detect

Analog modules

•2x 16-bit ADC

—Each ADC can be used as two single end inputADC, or one differential input ADC

—Up to 2 Msps in 16-bit mode, and 3.15 Msps in 12-bit mode

—Up to 75 ADC Input channels (depending on the package)

—One integrated temperature sensor per ADC.

•Three High-speed Comparators with 17 input pins and8-bit DAC as internal reference

•2x CMP is functional down to DPD mode

•Two 12-bit DAC with sample rates of up to 1.0 MSample/sec.

•One 14-bit DAC with sample rates of up to 5 MSample/sec.

•Three OpAmps can be configured to:

—Programmable Gain Amplifier

—Differential Amplifier

—Instrument Amplifier

—Transconductance Amplifier

•Highly accurate VREF ±0.2 and 15 ppm/deg C drift

Timers

•Five 32-bit standard general-purpose asynchronoustimers/counters, which support up to four capture inputsand four compare outputs, PWM mode, and externalcount input. Specific timer events can be selected togenerate DMA requests.

•SCTimer/PWM

•LPTimer

•10x LP Flexcomms each supports SPI, I2C, UART

•2x FlexCAN with FD, 2x I3Cs, 2x SAI

•1x Ethernet with QoS

•1x FlexIO programmable as a variety of serial andparallel interfaces, including, but not limited to DisplayDriver and camera interface

•2x EVM Smart Card Interfaces

•Programmable Logic Unit (PLU)

Motor Control Subsys

•2x FlexPWM each with 4 sub-modules, providing 12PWM outputs (no Nanoedge module)

•2x Quadrature Encoder/Decoder (ENC)

•1x Event Generator (AND/OR/INVERT) module supportup to 8 output trigger

•SINC Filter Module (3rd order, 5ch, Break signalsconnections to PWM)

Inputs Supply Voltage options:

•Integrated voltage regulator

—Buck DC-DC, Core LDO, other LDOs

•Separate AON domain on VDD_BAT pin

•Operating voltage: 1.71 V to 3.6 V

•IOs: 1.71 V-3.6 V full-performance

Operating Characteristics

•Temperature range: -40 °C to 125 °C

•Encoder

•Frequency measurement timer

•Multi-Rate Timer

•Windowed Watchdog Timer

•RTC with calendar

•Micro Timer

•OS Event Timer

HMI

•Digital PDM Microphone

—Allows connection of up to 4 MEMS microphoneswith PDM output

•TSI (Capacitive Touch Sensor Interface)

—Up to 25 self-cap channels, and up to 8 TX x 17 RXmutual-cap channels

—Water proof under self-cap mode

—Functions down to Power-Down Mode

•Up to 124 GPIOs

—1.2 V support at reduced performance (availableonly on Fast pads)

—Five independent IO power rings

—100 MHz IO on P2 and P3

—Up to 28-pin wake-up sources function down to deep power-down mode

—Support 1.71 V~3.6 V IO supply range