FEATURES

• Flat chip contacted top and bottom (silver)

• Wide temperature range from -55 °C to +175 °C

• Specified at 100 °C for better temp. control

• Highly resistant to thermal shocks

• Ideal for wire bonding (aluminum or gold

depending on metalization type)

• Delivered on blister tape

• Material categorization:

for definitions of compliance please see

www.vishay.com/doc?99912

APPLICATIONS

• High temperature sensing, control and compensation.

E.g. IGBT modules (inverters in EV and HEV vehicles)

• IC and semiconductor protecting

• DC/AC power inverters and HIC overheat protecting

DESIGN-IN SUPPORT

For complete curve computation, please visit:

www.vishay.com/thermistors/ntc-curve-list/

MARKING

The thermistors have no marking and have electrode

termination design without orientation.

Encapsulation:

• In order to preserve the characteristics of the bonded die

at long term an encapsulation is mandatory

• The encapsulation is defined by the customer. Silicon and

epoxy encapsulations have been tested.For

recommendations on compatible encapsulants contact

Vishay

The behavior of the connected die is strongly depending on

the particular processing and application conditions and we

recommend to the users to test, verify, and validate for

themselves their particular application. Vishay will not

endorse any responsibility of an abnormal behavior of

components having been processed in non validated

executions.