MSB410中文资料PDF规格书
MSB410规格书详情
Features
Glass passivated junction.
Ideal for printed circuit board.
Reliable low cost construction utilizing
molded plastic technique.
High surge current capability.
High temperature soldering guaranteed:
260℃/10 seconds at terminals.
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
MORNSUN/金升阳 |
23+ |
DIP |
90000 |
只做原厂渠道价格优势可提供技术支持 |
询价 | ||
MORNSUN |
22+ |
DIP |
25000 |
只做原装进口现货,专注配单 |
询价 | ||
MORNSUN |
23+ |
MODULE |
5000 |
原装正品,假一罚十 |
询价 | ||
NEC |
1984 |
DIP |
21 |
询价 | |||
MORNSUN |
22+ |
DIP |
25000 |
只做原装进口现货,专注配单 |
询价 | ||
金升阳 |
900 |
询价 | |||||
MORNSUN/金升阳 |
2021+ |
DIP |
100500 |
一级代理专营品牌!原装正品,优势现货,长期排单到货 |
询价 | ||
MORNSUN |
DIP |
22+ |
6000 |
十年配单,只做原装 |
询价 | ||
MORNSUN |
2023+ |
DIP |
80000 |
一级代理/分销渠道价格优势 十年芯程一路只做原装正品 |
询价 | ||
MORNSUN |
23+ |
NA |
1530 |
航宇科工半导体-中国航天科工集团战略合作伙伴! |
询价 |
