Features

• package: white SMT package, colorless clear resin

• feature of the device: top mount or reverse mount; ideal for extremely flat backlight

• wavelength: 570 nm (green)

• viewing angle: Lambertian Emitter (120°)

• technology: InGaAlP

• optical efficiency: 4 lm/W

• grouping parameter: luminous intensity, wavelength

• assembly methods: suitable for all SMT assembly methods

• soldering methods: IR reflow soldering

• preconditioning: acc. to JEDEC Level 2

• taping: 8 mm tape with 3000/reel, ø180 mm or 12000/reel, ø330 mm

• ESD-withstand voltage: up to 2 kV acc. to JESD22-A114-B

Applications

• coupling into light guides

• Key pad illumination

• optical indicators

• backlighting (LCD, cellular phones, switches, keys, displays, illuminated advertising)

• Interior automotive lighting (e.g. dashboard backlighting, etc.)