首页>K4T1G084QE-HCLE6>规格书详情

K4T1G084QE-HCLE6中文资料PDF规格书

K4T1G084QE-HCLE6
厂商型号

K4T1G084QE-HCLE6

功能描述

1Gb E-die DDR2 SDRAM

文件大小

1.0829 Mbytes

页面数量

46

生产厂商 Samsung Group
企业简称

Samsung三星

中文名称

三星半导体官网

原厂标识
数据手册

下载地址一下载地址二

更新时间

2024-5-29 11:42:00

K4T1G084QE-HCLE6规格书详情

The 1Gb DDR2 SDRAM is organized asa 32Mbit x 4 I/Os x 8banks, 16Mbit x 8 I/Os x 8banks or 8Mbit x 16 I/Os x 8 banks device. This synchronous device achieves high speed double-data-rate transfer rates of up to 800Mb/sec/pin (DDR2-800) for general applications.

Key Features

• JEDEC standard VDD= 1.8V ± 0.1V Power Supply

•VDDQ= 1.8V ± 0.1V

• 333MHz fCKfor 667Mb/sec/pin, 400MHz fCKfor 800Mb/sec/pin

• 8 Banks

• Posted CAS

• Programmable CASLatency: 3, 4, 5, 6

• Programmable Additive Latenc y: 0, 1, 2, 3, 4, 5

• Write Latency(WL) = Read Latency(RL) -1

• Burst Length: 4 , 8(Interleave/nibble sequential)

• Programmable Sequential / Interleave Burst Mode

• Bi-directional Differential Data-Strobe (Single-ended data-strobe is an optional feature)

• Off-Chip Driver(OCD) Impedance Adjustment

• On Die Termination

• Special Function Support

- 50ohm ODT

- High Temperature Self-Refresh rate enable

• Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE <95 °C

• All of products are Lead-Free, Halogen-Free, and RoHS compliant

产品属性

  • 型号:

    K4T1G084QE-HCLE6

  • 制造商:

    SAMSUNG

  • 制造商全称:

    Samsung semiconductor

  • 功能描述:

    1Gb E-die DDR2 SDRAM

供应商 型号 品牌 批号 封装 库存 备注 价格
SAMSUNG/三星
21+
BGA
11600
优势代理渠道,原装正品,可全系列订货开增值税票
询价
Samsung
2023+
BGA
80000
一级代理/分销渠道价格优势 十年芯程一路只做原装正品
询价
SAMSUNG/三星
22+
FBGA
9600
原装现货,优势供应,支持实单!
询价
SAMSUNG/三星
22+
FBGA
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
询价
SAMSANG
19+
BGA
256800
原厂代理渠道,每一颗芯片都可追溯原厂;
询价
SAMSUNG/三星
BGA
265209
假一罚十原包原标签常备现货!
询价
23+
BGA
500
优势渠道、优势价格
询价
SAMSUNG/三星
23+
BGA
50000
全新原装正品现货,支持订货
询价
SEC
2021+
BGA
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货
询价
SAMSUNG/三星
23+
FBGA
25500
授权代理直销,原厂原装现货,假一罚十,特价销售
询价