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IS61NLP25636A-200B3I集成电路(IC)存储器规格书PDF中文资料

IS61NLP25636A-200B3I
厂商型号

IS61NLP25636A-200B3I

参数属性

IS61NLP25636A-200B3I 封装/外壳为165-TBGA;包装为托盘;类别为集成电路(IC) > 存储器;产品描述:IC SRAM 9MBIT PARALLEL 165TFBGA

功能描述

256K x 36 and 512K x 18 9Mb, PIPELINE (NO WAIT) STATE BUS SRAM
IC SRAM 9MBIT PARALLEL 165TFBGA

文件大小

261.57 Kbytes

页面数量

37

生产厂商 Integrated Silicon Solution Inc
企业简称

ISSIISSI公司

中文名称

ISSI有限公司官网

原厂标识
数据手册

原厂下载下载地址一下载地址二

更新时间

2024-4-29 21:00:00

IS61NLP25636A-200B3I规格书详情

DESCRIPTION

The 9 Meg NLP/NVP product family feature high-speed, low-power synchronous static RAMs designed to provide a burstable, high-performance, no wait state, device for networking and communications applications. They are organized as 256K words by 36 bits and 512K words by 18 bits, fabricated with ISSIs advanced CMOS technology.

FEATURES

• 100 percent bus utilization

• No wait cycles between Read and Write

• Internal self-timed write cycle

• Individual Byte Write Control

• Single R/W (Read/Write) control pin

• Clock controlled, registered address, data and control

• Interleaved or linear burst sequence control using MODE input

• Three chip enables for simple depth expansion and address pipelining

• Power Down mode

• Common data inputs and data outputs

• CKE pin to enable clock and suspend operation

• JEDEC 100-pin TQFP, 165-ball PBGA and 119- ball PBGA packages

• Power supply:

NVP: VDD 2.5V (± 5), VDDQ 2.5V (± 5)

NLP: VDD 3.3V (± 5), VDDQ 3.3V/2.5V (± 5)

• JTAG Boundary Scan for PBGA packages

• Industrial temperature available

• Lead-free available

IS61NLP25636A-200B3I属于集成电路(IC) > 存储器。ISSI有限公司制造生产的IS61NLP25636A-200B3I存储器存储器是集成电路上用作数据存储设备的半导体器件。这些器件分为非易失性或易失性两种,格式包括 CBRAM、DRAM、EEPROM、EERAM、EPROM、闪存、FRAM、NVSRAM、PCM (PRAM)、PSRAM、RAM 和 SRAM。这些器件的存储容量为 64 b 至 6 Tb 不等,接口有 I2C、MMC、并行、eMMC、串行、单线、SPI、UFS、Xccela 总线和 1-线。

产品属性

  • 产品编号:

    IS61NLP25636A-200B3I

  • 制造商:

    ISSI, Integrated Silicon Solution Inc

  • 类别:

    集成电路(IC) > 存储器

  • 包装:

    托盘

  • 存储器类型:

    易失

  • 存储器格式:

    SRAM

  • 技术:

    SRAM - 同步,SDR

  • 存储容量:

    9Mb(256K x 36)

  • 存储器接口:

    并联

  • 电压 - 供电:

    3.135V ~ 3.465V

  • 工作温度:

    -40°C ~ 85°C(TA)

  • 安装类型:

    表面贴装型

  • 封装/外壳:

    165-TBGA

  • 供应商器件封装:

    165-TFBGA(13x15)

  • 描述:

    IC SRAM 9MBIT PARALLEL 165TFBGA

供应商 型号 品牌 批号 封装 库存 备注 价格
ISSI, Integrated Silicon Solut
21+
165-TFBGA(13x15)
56200
一级代理/放心采购
询价
ISSI(美国芯成)
23+
TFBGA165(13x15)
7350
现货供应,当天可交货!免费送样,原厂技术支持!!!
询价
ISSI
22+
BGA
6500
只做原装正品.或订货假一赔十!
询价
ISSI
1525+
BGA
30000
绝对原装进口环保现货可开17%增值税发票
询价
ISSI
2020+
BGA
650
原装现货,优势渠道订货假一赔十
询价
ISSI, Integrated Silicon Solut
21+
54-VFBGA
5280
进口原装!长期供应!绝对优势价格(诚信经营
询价
ISSI
24+
BGA
16000
原装优势绝对有货
询价
ISSI
23+
165-PBGA(13x15)
73390
专业分销产品!原装正品!价格优势!
询价
ISSI,
21+
25000
原厂原包 深圳现货 主打品牌 假一赔百 可开票!
询价
ISSI, Integrated Silicon Solut
21+
165-TBGA
6000
正规渠道/品质保证/原装正品现货
询价