Description

The SOP-8 has been modified through a customized leadframe

for enhanced therma characteristics and multiple-die capability

making it ideal in a variety of power applications. With these

improvements multiple devices can be used in an application

with dramatically reduced board space.The package is designed

for vapor phase,infra redor wave soldering techniques.

Power dissipation of greater than 0.8W is possible in a typical

PCB mount application.

Generation VTechnology

Ultra Low On-Resistance

P-Channel Mosfet

Surface Mount

Available in Tape&Reel

Dynamic dv/dt Rating

Fast Switching

Lead-Free

Features