HJ1264HLP

DATA SUBJECT TO CHANGE WITHOUT NOTLCE

HJ1264HLP

Bo챤te de jonction en acier doux de types 4 et 12

HJ1264HLP

包装：散装 类别：盒子，外壳，机架 箱 描述：BOX STEEL GRAY 12\

HJ1264HLP

包装：散装 类别：盒子，外壳，机架 箱 描述：BOX STEEL GRAY 12\

AC1264

10TO1200MHzTO-8CASCADABLEAMPLIFIER

ACMP-1264

PowerCommonModeChokes

Features •CommercialGrade •PPAPreadyandsupported •Excellentimpedancecharacteristics •Ratedcurrentupto10A •ExtremelyLowDCR Applications •DCpowerlinecommonmodenoisesuppression. •SwitchModePowerSuppliesandregulators •VariableFrequencyDrives •AC/DCpowerr

AGM1264B

LCDMODULE

0.3-7.0V;1.8mA;numberofdots128x64dots;dotsize0.48x0.48mm;dotpitch0.52x0.52mm;AZdisplay

AGM1264D

LCDMODULE

0.3-7.0V;1.0mA;numberofdots128x64dots;dotsize0.39x0.55mm;dotpitch0.44x0.60mm;AZdisplay

AGM1264E

LCDMODULE

0.0-5.5V;0.7mA;numberofdots128x64dots;dotsize0.48x0.48mm;dotpitch0.52x0.52mm;AZdisplay

AGM1264F

SPECIFICATIONSFORLIQUIDCRYSTALDISPLAY

AGM1264FSERIESGRAPHICMODULE 1.0MECHANICALSPECS 2.OverallModuleSize93.0mm(W)x70.0mm(H)xmax14.0mm(D)forLEDbacklightversion 93.0mm(W)x70.0mm(H)xmax9.5mm(D)forreflectiveversion 3.DotSize0.48mm(W)x0.48mm(H) 4.DotPitch0.52mm(W)

AGM1264H

SPECIFICATIONSFORLIQUIDCRYSTALDISPLAY

MECHANICALSPECIFICATIONS DOTS128X64DOTS DOTSIZE0.48X0.48mm MODULEDIMENSION77.5(W)×51.3(H)×2.8(T)mm VIEWINGAREA70.7(W)×38.8(H)mm APPROX.WEIGHT30G LCDTYPEFSTN(Positive/Transflective) DUTY,BIAS1/64,1/9 VIEWINGDIRECTION12O’clock

AGM1264H-FLW-FTW

STANDARDCHIP-ON-GLASSDISPLAYS

FEATURES InaCOGdisplay,abareICcalled“goldbump”or“flipchip”isconnectedtotransparenttracesontheLCDglass(noPCBneeded). COMPACT:veryspaceeconomical,modulescanbeasthinas2mm INEXPENSIVE:costeffectiveoverCOB&SMTmodules,especiallyforgraphicLCD’s,bec

AGM1264H-FN-FTW

STANDARDCHIP-ON-GLASSDISPLAYS

FEATURES InaCOGdisplay,abareICcalled“goldbump”or“flipchip”isconnectedtotransparenttracesontheLCDglass(noPCBneeded). COMPACT:veryspaceeconomical,modulescanbeasthinas2mm INEXPENSIVE:costeffectiveoverCOB&SMTmodules,especiallyforgraphicLCD’s,bec

AGM1264H-RN-GTS

STANDARDCHIP-ON-GLASSDISPLAYS

FEATURES InaCOGdisplay,abareICcalled“goldbump”or“flipchip”isconnectedtotransparenttracesontheLCDglass(noPCBneeded). COMPACT:veryspaceeconomical,modulescanbeasthinas2mm INEXPENSIVE:costeffectiveoverCOB&SMTmodules,especiallyforgraphicLCD’s,bec

AGM1264K

SPECIFICATIONSFORLIQUIDCRYSTALDISPLAY

INTRODUCTION Thisdocumentspecifiestheoutsidedimensions,opticalcharacteristics,electricalcharacteristics,interface,controllercommands,etc.oftheLCDmodule. FEATURES (1)CompactintregalCOGdisplaymodule (2)Lowpowerconsumption. (3)128x164dotsFSTNLCDmodule. (4)Positive

AGM1264K

SPECIFICATIONSFORLIQUIDCRYSTALDISPLAY

MECHANICALSPECS 1.OverallModuleSize78.0mm(W)x70.0mm(H)xmax13.0mm(D)forLEDbacklightversion 2.DotSize0.39mm(W)x0.55mm(H) 3.DotPitch0.44mm(W)x0.60mm(H) 4.Duty1/64 5.ControllerICS6B0108orEQUI 6.LCFluidOptionsSTN 7.PolarizerOptionsReflective,transflective,Tr

AGM1264K-FN-FBS

STANDARDCHIP-ON-GLASSDISPLAYS

FEATURES InaCOGdisplay,abareICcalled“goldbump”or“flipchip”isconnectedtotransparenttracesontheLCDglass(noPCBneeded). COMPACT:veryspaceeconomical,modulescanbeasthinas2mm INEXPENSIVE:costeffectiveoverCOB&SMTmodules,especiallyforgraphicLCD’s,bec

AGM1264M

SPECIFICATIONSFORSPECIFICATIONSFOR

SPECIFICATIONSFORLIQUIDCRYSTALDISPLAY

AGM1264M-FL-FBW

STANDARDCHIP-ON-GLASSDISPLAYS

FEATURES InaCOGdisplay,abareICcalled“goldbump”or“flipchip”isconnectedtotransparenttracesontheLCDglass(noPCBneeded). COMPACT:veryspaceeconomical,modulescanbeasthinas2mm INEXPENSIVE:costeffectiveoverCOB&SMTmodules,especiallyforgraphicLCD’s,bec

AGM1264N

SPECIFICATIONSFORLIQUIDCRYSTALDISPLAY

Features A.DriveMethod:1/65Duty,1/9Bias B.TheModuleOperatingVoltage:3V; C.TheLCDOperatingVoltage:9.0V; D.ViewingDirection:12:00 E.OperatingTemperature:0~50°C F.StorageTemperature:-20~70°C G.Displaytype:STNorFSTN/PositiveorNegative MechanicalData: (1)