| 零件编号 | 下载&订购 | 功能描述 | 制造商&上传企业 | LOGO |
|---|---|---|---|---|
SiliconSchottkyBarrierDiode Features ●Highforwardcurrent,Lowcapacitance. ●HSB276Swhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. ●CMPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly. | KEXINGUANGDONG KEXIN INDUSTRIAL CO.,LTD 科信电子广东科信实业有限公司 | KEXIN | ||
SiliconSchottkyBarrierDiodeforDetectorandMixer Features •Highforwardcurrent,Lowcapacitance. •HSB276Swhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. •CMPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly. | RENESASRenesas Electronics America 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforBalancedMixer Features •Highforwardcurrent,Lowcapacitance. •HSB276Swhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. •CMPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly. | HitachiHitachi, Ltd. 日立公司 | Hitachi | ||
SiliconSchottkyBarrierDiodeforMixer Features •Highforwardcurrent,Lowcapacitance. •UltrasmallFlatPackage(UFP)issuitableforsurfacemountdesign. | HitachiHitachi, Ltd. 日立公司 | Hitachi | ||
HSC276_03 | RENESASRenesas Electronics America 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiode Features ●Highforwardcurrent,Lowcapacitance. ●UltrasmallFlatPackage(UFP)issuitableforsurfacemountdesign. | KEXINGUANGDONG KEXIN INDUSTRIAL CO.,LTD 科信电子广东科信实业有限公司 | KEXIN | ||
SiliconSchottkyBarrierDiodeforMixer Features •Highforwardcurrent,Lowcapacitance. •UltrasmallFlatLeadPackage(UFP)issuitableforsurfacemountdesign. | RENESASRenesas Electronics America 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforMixer Features •Highforwardcurrent,Lowcapacitance. •UltrasmallFlatPackage(UFP)issuitableforsurfacemountdesign. | HitachiHitachi, Ltd. 日立公司 | Hitachi | ||
SiliconSchottkyBarrierDiodeforDetector | RENESASRenesas Electronics America 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforDetector | HitachiHitachi, Ltd. 日立公司 | Hitachi | ||
SiliconSchottkyBarrierDiodeforDetector | RENESASRenesas Electronics America 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforBalancedMixer Features •Highforwardcurrent,Lowcapacitance. •HSM276ASwhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. •MPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly. | RENESASRenesas Electronics America 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforBalancedMixer Features •Highforwardcurrent,Lowcapacitance. •HSM276ASwhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. •MPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly. | HitachiHitachi, Ltd. 日立公司 | Hitachi | ||
SiliconSchottkyBarrierDiodeforBalancedMixer Features •Highforwardcurrent,Lowcapacitance. •HSM276ASRwhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. •MPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly. | RENESASRenesas Electronics America 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforBalancedMixer Features •Highforwardcurrent,Lowcapacitance. •HSM276ASRwhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. •MPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly. | HitachiHitachi, Ltd. 日立公司 | Hitachi | ||
SiliconSchottkyBarrierDiodeforBalancedMixer Features •Highforwardcurrent,Lowcapacitance. •HSM276Swhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. •MPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly. | RENESASRenesas Electronics America 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiode Features ●Highforwardcurrent,Lowcapacitance. ●HSM276ASRwhichisinterconnectedinseriesconfiguration isdesignedforbalancedmixeruse. ●MPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly. | KEXINGUANGDONG KEXIN INDUSTRIAL CO.,LTD 科信电子广东科信实业有限公司 | KEXIN | ||
SiliconSchottkyBarrierDiodeforBalancedMixer Features •Highforwardcurrent,Lowcapacitance. •HSM276Swhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. •MPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly. | HitachiHitachi, Ltd. 日立公司 | Hitachi | ||
SiliconSchottkyBarrierDiodeforBalancedMixer Features •Highforwardcurrent,Lowcapacitance. •HSM276SRwhichisinterconnectedinseriesconfigurationisdesignedforbalancedmixeruse. •MPAKpackageissuitableforhighdensitysurfacemountingandhighspeedassembly. | HitachiHitachi, Ltd. 日立公司 | Hitachi | ||
SiliconSchottkyBarrierDiode Features •Highforwardcurrent,Lowcapacitance. •HSM276ASRwhichisinterconnectedinseriesconfigurationisdesignedforbalancedmixeruse. •MPAKpackageissuitableforhighdensitysurfacemountingandhighspeedassembly. | KEXINGUANGDONG KEXIN INDUSTRIAL CO.,LTD 科信电子广东科信实业有限公司 | KEXIN |
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
CHINA |
22+ |
DIP8CSOP8 |
640 |
航宇科工半导体-央企合格优秀供方! |
询价 | ||
23+ |
2013+ |
7300 |
专注配单,只做原装进口现货 |
询价 | |||
23+ |
2013+ |
7300 |
专注配单,只做原装进口现货 |
询价 | |||
O2 |
SSOP8 |
11 |
询价 | ||||
N/A |
2023+ |
SSOP8 |
50000 |
原装现货 |
询价 | ||
MB |
22+ |
PLCC |
2000 |
进口原装!现货库存 |
询价 | ||
23+ |
N/A |
85900 |
正品授权货源可靠 |
询价 | |||
S |
2017+ |
CDIP |
32568 |
深圳代理原装现货进口库存(香港-日本-台湾)开17点增票 |
询价 | ||
NEC |
23+ |
31720 |
##公司主营品牌长期供应100%原装现货可含税提供技术 |
询价 | |||
原厂 |
23+ |
SOP |
5000 |
原装正品,假一罚十 |
询价 |
相关规格书
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- F2-807-1R
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相关库存
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- F28-040-C2-B
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