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EP3C55中文资料PDF规格书

EP3C55
厂商型号

EP3C55

参数属性

EP3C55 封装/外壳为484-BGA;包装为托盘;类别为集成电路(IC) > FPGA(现场可编程门阵列);产品描述:IC FPGA 327 I/O 484FBGA

功能描述

1. Cyclone III Device Family Overview

文件大小

395.27 Kbytes

页面数量

14

生产厂商 Altera Corporation
企业简称

Altera阿尔特

中文名称

阿尔特拉公司官网

原厂标识
数据手册

下载地址一下载地址二

更新时间

2024-5-22 13:07:00

EP3C55规格书详情

Cyclone III Device Family Overview

Cyclone® III device family offers a unique combination of high functionality, low power and low cost. Based on Taiwan Semiconductor Manufacturing Company (TSMC) low-power (LP) process technology, silicon optimizations and software features to minimize power consumption, Cyclone III device family provides the ideal solution for your high-volume, low-power, and cost-sensitive applications. To address the unique design needs, Cyclone III device family offers the following two variants:

■ Cyclone III—lowest power, high functionality with the lowest cost

■ Cyclone III LS—lowest power FPGAs with security

With densities ranging from about 5,000 to 200,000 logic elements (LEs) and 0.5 Megabits (Mb) to 8 Mb of memory for less than ¼ watt of static power consumption, Cyclone III device family makes it easier for you to meet your power budget. Cyclone III LS devices are the first to implement a suite of security features at the silicon, software, and intellectual property (IP) level on a low-power and high-functionality FPGA platform. This suite of security features protects the IP from tampering, reverse engineering and cloning. In addition, Cyclone III LS devices support design separation which enables you to introduce redundancy in a single chip to reduce size, weight, and power of your application.

This chapter contains the following sections:

■ “Cyclone III Device Family Features” on page 1–1

■ “Cyclone III Device Family Architecture” on page 1–6

■ “Reference and Ordering Information” on page 1–12

产品属性

  • 产品编号:

    EP3C55F484C6N

  • 制造商:

    Intel

  • 类别:

    集成电路(IC) > FPGA(现场可编程门阵列)

  • 系列:

    Cyclone® III

  • 包装:

    托盘

  • 电压 - 供电:

    1.15V ~ 1.25V

  • 安装类型:

    表面贴装型

  • 工作温度:

    0°C ~ 85°C(TJ)

  • 封装/外壳:

    484-BGA

  • 供应商器件封装:

    484-FBGA(23x23)

  • 描述:

    IC FPGA 327 I/O 484FBGA

供应商 型号 品牌 批号 封装 库存 备注 价格
原厂
13+
IC
1
普通
询价
Intel FPGAs/Altera
21+
164-TFBGA
3860
进口原装!长期供应!绝对优势价格(诚信经营
询价
ALTERA
BGA
6688
15
现货库存
询价
Altera
20+/21+
DIP52
5600
全新原装进口价格优惠
询价
ALTERA
21+
BGA
50000
全新原装正品现货,支持订货
询价
ALTERA
2236+
BGA
4278
一级代理/分销渠道价格优势 十年芯程一路只做原装正品
询价
ALTERA/阿尔特拉
22
BGA
15000
3月31原装,微信报价
询价
ALTERA/阿尔特拉
22+/23+
BGA
9800
原装进口公司现货假一赔百
询价
ALTERA/阿尔特拉
21+
BGA
5000
全新原装现货 价格优势
询价
ALTREA
22+
BGA
12245
现货,原厂原装假一罚十!
询价