This family of NPN Silicon Epitaxial transistors is designed for use

as a general purpose amplifier and in switching applications. The

device is housed in the SOT−223 package which is designed for

medium power surface mount applications.

Features

• High Voltage

• The SOT-223 Package Can Be Soldered Using Wave or Reflow

• SOT-223 Package Ensures Level Mounting, Resulting in Improved

Thermal Conduction, and Allows Visual Inspection of Soldered Joints

• The Formed Leads Absorb Thermal Stress During Soldering,

Eliminating the Possibility of Damage to the Die

• PNP Complement is BSP16T1G

• Moisture Sensitivity Level (MSL): 1

• NSV Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC−Q101

Qualified and PPAP Capable

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant

BSP19AT1G属于分立半导体产品 > 晶体管 - 双极性晶体管（BJT）- 单个。安森美半导体公司制造生产的BSP19AT1G晶体管 - 双极性晶体管（BJT）- 单个分立式双极结型晶体管 (BJT) 通常在音频、无线电及其他应用中用于构建模拟信号放大功能。作为大批量生产的第一批半导体器件之一，对于涉及高频开关和在大电流或高电压下工作的应用而言，它们的特性相比某些器件类型不占优势，但对于需要以极小的噪声和失真构建模拟信号的应用而言，它们仍然是首选技术。