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22-03-2031中文资料PDF规格书

22-03-2031
厂商型号

22-03-2031

功能描述

Includes KK100,HDM,EBBl 50D, SEARAY,Plateau HS Mezz,IEEE1386,SlimStack Product Families. Pitches range:0.635mm-2.54mm

文件大小

47.15 Kbytes

页面数量

6

生产厂商 MolexKits
企业简称

MOLEXKITS莫仕

中文名称

莫仕连接器官网

原厂标识
数据手册

下载地址一下载地址二

更新时间

2024-5-31 11:16:00

22-03-2031规格书详情

Product Highlights

The SEARAY board-to-board connector is designed for computer, networking, telecom, storage and general market applications with high pin-count devices or memory modules that are mounted on mezzanine or module PC Boards (PCBs). The design of our SEARAY has superior electrical and mechanical features that are cost competitive. The unique, Molex-patented, solder charge technology results in better process yields and a lower applied cost versus equivalent BGA connector products. Circuit sizes range from 160 through 500 positions, and mated stack heights cover 7mm (.276) to 13mm (.512).

Features and Benefits

• Unique patented solder attach is more cost effective and reliable than BGA

• SEARAY footprint is compatible with other 1.27mm(.050) by 1.27mm(.050) products

• Robust guidance and polarization aligns connectors to mate in correct position

• Advanced gold-plated housings with integrated shielding system

• Two points of contact on each signal

• Multiple stack heights from 10 to25mm (.394 to .984)

• Available in 6, 12, 24, and 36 differential pair sizes (12, 24, 48 and 72 contacts)

• Up to 32mm board-to-board stack heights

• For parallel board packaging

• Available in press-fit or solder tail

• For Mezzanine cards, parallel backplanes and bridge board applications

• End walls facilitate blind mating

• Surface Mount Compatible

• High-density 2.00mm metric connector in the same form factor as Future bus

• 6-row 2mm connector provides 30 contacts per linear centimeter (> 75/inch)

• Designed for high-density, high-speed applications

• Modular components for design flexibility; 72 position (6 row by 12) and 144 position (6 row by 24) modules

• Tail lengths available in 0.5mm increments to optimize PCB thickness

• 3 GHz performance

• Cross Talk < 7

• 6.00 to 16.00mm stack heights

• Economical design

• For 50 and 100 Ohm applications

• Anti-flux design

• Metal solder tabs provide PCB hold down and strain relief for SMT tails

• Polarizing pegs assist placement

• Housing lock on 20 to 60 circuits

• Superior terminal design/wipe length

• Easy board processing

• End-to-end stackable

• Strain relieving board hooks

• Also available without board hooks

• Various pin lengths available

• Voided circuits available (contact Molex)

• Versions to accept mating pins vertically, horizontally or through the PCB

• Leaf-style design protects pins

• Low insertion force

• For use in combinations of 1 to 4 mated pairs

• High-temperature LCP housing for use with lead-free processing temps

• Multiple stack heights 8.00-15.00mm (.315-.591), offers design flexibility

• Low mating forces, less stress on PCB and solder joints

• Select 30u Gold plating on contact, high reliability with 100-cycle durability rating

• Anti-flux intrusion feature, compatible with no-wash soldering processes

• Polarized D-shape leaf contact for parallel board packaging

• Leaf-style interface provides highdurability

• Available in 50, 68, and 80 circuits

• Blind-mate version

• SMT versions available

• Receptacle mates to standard .062 inch pc card edge

• Polarized guide posts allow extra lead-in on blind-mate versions

• Polarized guide features provide generous 2.0mm radial lead-in for blind mating

• Press-fit retention pegs for mechanical hold down before and after processing

• Low profile—12.50mm (.492) stack height for parallel board stacking

• Surface Mount Compatible

Applications

• High and Mid-Range Computers and Servers

• Medical Scanning Equipment

• Military

• Network Routers and Switches

• Mobile Base Stations

• Mobile Phone

• PDA

• Digital Video Camera

• Digital Still Camera

• Digital Video Player

• Digital Audio Player

• Voice Recorder

• Notebook PC

• Any Compact Applications

• Switches and Hubs

• Routers

• Servers and Blade Servers

• Workstations

• Storage Devices

• High-End Computer

• Storage

• Telecom (General)

• Broadcast Equipment

• Telecom Infrastructure

• Networking

• Telecom (Home/Office)

• Vending and Gaming Machines

• Production Equipment

• Industrial Instruments

• Energy and Power

• Comfort and Infotainment

• Brown Goods

• Security and Alarms

• Business Machines

• Computer Peripherals

• Consumer (General)

• Vending and Gaming

• Business Machines

• High-End Computer

• Production Equipment

• Network Interface Cards for NIC-HBA

• SCSI Host Bus and Adapter Cards for NIC-HBA

• Board-to-Board Mezzanine Connectors for SwitchRouter

• Mezzanine Card Connectors for Server

• Mezzanine Card Connectors for Disk Array

产品属性

  • 型号:

    22-03-2031

  • 功能描述:

    集管和线壳 VERT PCB HDR 3P TIN PLATING

  • RoHS:

  • 产品种类:

    1.0MM Rectangular Connectors

  • 产品类型:

    Headers - Pin Strip

  • 系列:

    DF50

  • 触点类型:

    Pin(Male)

  • 节距:

    1 mm

  • 位置/触点数量:

    16

  • 排数:

    1

  • 安装风格:

    SMD/SMT

  • 安装角:

    Right

  • 端接类型:

    Solder

  • 外壳材料:

    Liquid Crystal Polymer(LCP)

  • 触点材料:

    Brass

  • 触点电镀:

    Gold

  • 制造商:

    Hirose Connector

供应商 型号 品牌 批号 封装 库存 备注 价格
MOLEX/莫仕
2308+
300000
一级代理,原装正品!
询价
MOLEX/莫仕
2021+
NA
10000
原厂授权代理,海外优势订货渠道。可提供大量库存,详
询价
MOLEX
三年内
1983
纳立只做原装正品13590203865
询价
23+
N/A
82000
一级代理放心采购
询价
MOLEX
2021+
C0603
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货
询价
MOLEX
23+
589610
新到现货 原厂一手货源 价格秒杀代理!
询价
MOLEX
NA
41606
一级代理 原装正品假一罚十价格优势长期供货
询价
MOLEX
22+
NA
425
原装正品支持实单
询价
Molex/WaldomElectronicsC
07+/08+
17043
询价
Molex
2023+
16800
芯为科技只做原装
询价