197

MINIATURE FUSES - 5x20mm

197

Temperature Sensors Line Guide

197

RUGGED and LIGHTWEIGHT ALUMINUM BATTERY HOLDERS

197

包装：托盘 类别：电池产品 电池座，电池夹，电池触头 描述：BATT HOLDER C 6 CELL SOLDER LUG

Keystone Electronics

1970004423N100

9th/8th Gen. Intel Xeon /Core™ Processor, 3.5 SBC w/ MIOe

Features ƒ9th/8thGen.Intel®Xeon®/Core™Processor,upto6cores,andTDP45W/25W ƒDualchannelDDR4-2400,upto64GB*,ECCforXeonSKU ƒTriplesimultaneousdisplayswith48-bitLVDS+HDMI+DP ƒUSB3.1Gen2(10Gbps),TPM2.0&NVMe/PCIeGen3x4SSD ƒDualGbE,SATAIII,RS-232/422/485,CA

1970004428N001

Intel® Atom™ E3900 / Pentium® / Celeron® N Series SMARC Module

Features ƒSMARC2.0&SMARC2.1Compliance ƒIntel®Atom™E3900/Pentium®/Celeron®NSeriesProcessors ƒIntegrateddualGbE.wirelessmoduleonboarddesign ƒDualchannelLPDDR42/4/8GBmemorydown&onboardeMMC ƒTripledisplay(DP++,HDMI,LVDS) ƒSupportsiManager,WISE-PaaS/DeviceO

1970004440T001

Development Kit for SMARC 2.0/2.1 Computer-on-Module ROM-5720

Features ƒƒNXPi.MX8MprocessorwithdualorquadArmCortexA53cores ƒƒ1xArmCortex-M4core ƒƒOnboard2GBLPDDR4memoryandeMMC16GB ƒƒ1xHDMI2.0upto4096x2160,1x4-LaneMIPIDSI ƒƒ2xUSB3.0,4xUSB2.0,4xUART,4xI2C,12xGPIO, 1xPCIe2.0,1x4-laneMIPICSIcamera

1970004470T001

Intel Xeon Processor D-1500 COM Express R3.0 Type 7 Module for Ruggedized Application

Features ƒCOMExpressR3.0BasicModuleType7pinout ƒIntel®Xeon®ProcessorD-1500ProductFamily ƒSolder-downmemoryw/ECC,max.32GB ƒHighspeedEthernet(dual10GBASE-KRinterfaces,oneGbE) ƒAbundantexpansion.(PCIex16,PCIex8,8PCIex1) ƒSupportsiManager,WISE-PaaS/Device

1970004482T000

9th/8th Gen. Intel Xeon /Core™ Processor, 3.5 SBC w/ MIOe

Features ƒ9th/8thGen.Intel®Xeon®/Core™Processor,upto6cores,andTDP45W/25W ƒDualchannelDDR4-2400,upto64GB*,ECCforXeonSKU ƒTriplesimultaneousdisplayswith48-bitLVDS+HDMI+DP ƒUSB3.1Gen2(10Gbps),TPM2.0&NVMe/PCIeGen3x4SSD ƒDualGbE,SATAIII,RS-232/422/485,CA

1970004483T001

NXP i.MX8X Cortex®-A35 SMARC 2.0/2.1 Computer-on-Module

Features ƒNXPi.MX8Xprocessorwith2-4xArmCortex-A35cores ƒ1xArmCortex-M4Fcoreand1xTensilica®HiFi4DSP ƒOnboard2GBLPDDR4memoryandeMMC16GB ƒ2xsinglechannelLVDSor2x4-LANEMIPIDSI ƒ1xUSB3.0,1xUSB2.0Host,1xUSB2.0OTG,2xCAN,3xUART,4xI2C, 12x

1970004537N001

Micro Computer, Intel® Core™ i7/i5/i3 CPU, H81, 2 Expansions, 250W 80Plus PSU

Features ƒIntel®H81Platform –Intel®4thgenCore™i7/i5/i3CPU(LGA1150) –OnePCIex16*&onePCIex4ExpansionSlots ƒCompact,well-thought-outdesign –Twointernal,shock-resistant,2.5SATAHDDbays –FrontaccessibleI/O:VGA+DVI-D,2GbELAN,3USB2.0,2COM –Easy-to-maintains

1970004537N001

Micro Computer with Intel® Core™ i7/i5/i3 Processor, Intel® H110 Chipset, 2 x Expansion Slots, and 250W 80PLUS PSU

Features ƒIntel®6th/7thGenCore™i7/i5/i3/Celeron®processerwithIntel®H110chipset ƒ1xPCIex16and1xPCIex4(1xPCIforAIMC-3202-01)expansionslots ƒCompactdesignwithfront-accessibleI/O ƒ1xVGA+DVI-D,2xGbELAN,3xUSB3.0,2xCOM ƒ2x2.5internal,shock-resistantS

1970004549N001

Intel 8th Gen U Series CORE i3/i5/i7 CPU,eDP (LVDS), 2 HDMI, 2 LAN, 2 USB3.2 Gen2 x1, 4 COM (RS-232/422/485),M.2 E-Key, M.2 B-Key, M.2 M-Key NVMe

Features ƒIntel®8thGenCore™i3-8145UE/i5-8365UE/i7-8665UE/CELERON 4305UE ƒSupports1xDDR4-2400SO-DIMM ƒSupports1xeDP(LVDSco-lay),2xHDMI,3IndependentDisplays ƒSupports2xLAN,2xUSB3.2Gen2x1Type-APorts,4COMPorts (RS-232/422/485,selectedviaBIOS) ƒSupport

1970004550N001

Intel 8th Gen U Series CORE i3/i5/i7 CPU,eDP (LVDS), 2 HDMI, 2 LAN, 2 USB3.2 Gen2 x1, 4 COM (RS-232/422/485),M.2 E-Key, M.2 B-Key, M.2 M-Key NVMe

Features ƒIntel®8thGenCore™i3-8145UE/i5-8365UE/i7-8665UE/CELERON 4305UE ƒSupports1xDDR4-2400SO-DIMM ƒSupports1xeDP(LVDSco-lay),2xHDMI,3IndependentDisplays ƒSupports2xLAN,2xUSB3.2Gen2x1Type-APorts,4COMPorts (RS-232/422/485,selectedviaBIOS) ƒSupport

1970004564N001

1U High Performance Rackmount Server with 3rd Gen. Intel® Xeon® Scalable processors

Features ƒIdealforhyperconvergedstorage,software-definedstorage,andhighend enterpriseserver ƒUpto4bays3.5SAS/SATAdrivessupport ƒDualsocketP+LGA41893rdGen.Intel®Xeon®Scalableprocessorssupport ƒ32xDDR4ECC-Registered2666/2933/3200MhzRDIMM/LRDIMM ƒHighlyscala

1970004564N001

2U High Performance Rackmount Server with 3rd Gen. Intel® Xeon® Scalable processors

Features ƒUpto12bays3.5SAS/SATAor24bays2.5hot-swapSAS/SATAdrives support ƒ32xDDR4ECC-Registered2666/2933/3200MhzRDIMM/LRDIMM ƒUpto4FHFL,2FHHLand2LowProfilePCIeGen4 ƒ2M.22280SATASSDsupport,Rear22.5SATA/SAS/NVMedrivesupport ƒ1OCP3.0PCIeGen4x16N

1970004564N001

2U High Performance Rackmount Server with 3rd Gen. Intel® Xeon® Scalable processors

Features ƒUpto12bays3.5SAS/SATAor24bays2.5hot-swapSAS/SATAdrives support ƒ32xDDR4ECC-Registered2666/2933/3200MhzRDIMM/LRDIMM ƒUpto4FHFL,2FHHLand2LowProfilePCIeGen4 ƒ2M.22280SATASSDsupport,Rear22.5SATA/SAS/NVMedrivesupport ƒ1OCP3.0PCIeGen4x16N

1970004564T010

Intel® 10th Gen Core™ processor,LGA1200 Mini-ITX motherboard

Features ƒSupportsIntel®10thGenCore™iprocessor(LGA1200)withIntelQ470E/ H420Echipset ƒTwo260-pinSO-DIMMupto64GBDDR42933MHzSDRAM ƒSupportsdisplaysofHDMI2.0a/DP1.2/VGA/LVDs(oreDP) ƒSupports1M.2Mkey&1M.2Ekey ƒSupports4USB3.2Gen2&4USB3.2Gen1,and3SA

1970004564T010

12th Gen. Intel® Core™ Processors S-series (LGA1700) on 4 EPIC SBC

Features ƒ12thGen.Intel®Core™Processorupto16Cores,TDP35W ƒHighscalabilitywithsockettypeCPU(LGA1700)&SupportStd.CPUcooler ƒDDR54800upto32GB+3simultaneousdisplay:DualHDMI+eDP ƒDualHighSpeed2.5GEthernetwithTSN,2xCOM,CANbus,TPM ƒ3Expansions:DualM

1970004565N001

LGA 4189 Intel® 3rd Gen Xeon® Scalable ATX Server Board with 8x DDR4, 3x PCIe x16, 8x SATA 3, 6x USB 3.2 (Gen1), Dual 10GbE, and IPMI

Features ƒLGA4189ATXserverboardwith3rdGen.Xeon®Scalableprocessor ƒDDR43200MHzRDIMMupto512GB(8DIMMs)supportsIntel®Optane™ PersistentMemory ƒFeatures3xPCIex16,1xPCIex8,2xPCIex4,and1xPCIex1 ƒIntel®X550dual10GbEports ƒEightSATA3andoneM.2connector